Connection apparatus for circuit board, ink jet type recording apparatus using the same, IC chip and ink cartridge having IC chip

ABSTRACT

A circuit board on an ink cartridge has contact pads which are electrically conducted to a semiconductor storage element mounted on the circuit board. Connector terminals on an ink jet recording apparatus are brought into relative slide contact with a surface of this circuit board, and electrically connected to the contact pads. When the connector terminals come in contact with the contact pads, the dust adhering to the connector terminals is wiped and removed by step portions that are constituted by no-resist-film formation parts and that are adjacent to the contact pads. Consequently, the reliability of the electrical contact between the connector terminals and the contact pads is ensured.

BACKGROUND OF THE INVENTION

[0001] This invention relates to a connection apparatus for a circuitboard configured so that connector terminals come in relative slidecontact with contact pads formed on a circuit board surface from adirection of a surface of the circuit board and electrically conductedthereto, and also relates to an ink jet type recording apparatus usingthis connection apparatus for a circuit board. The present inventionfurther relates to an IC chip (a circuit board) having contact pads anda memory device on a base (a substrate), and to an ink cartridge havingthe IC chip.

[0002] For example, an inkjet type recording apparatus is configured sothat a plurality of ink cartridges to be used therefor are detachablysupported by a cartridge holder and that ink of each color is suppliedto a recording head. Recently, there have been provided products of sucha kind of a recording apparatus, which are configured so thatinformation on the kind, color, and remaining amount of ink contained ineach of the ink cartridges is held at the corresponding ink cartridge,and that the aforementioned information is transferred between a mainunit of the recording apparatus and each of the ink cartridges tothereby achieve proper management of a printing operation.

[0003] Therefore, the ink cartridge has a circuit board (an IC chip) onwhich, for instance, a semiconductor storage device (a memory device)being capable of storing the aforementioned information is mounted. Inthe case that the ink cartridges are loaded in a cartridge holder, therecording apparatus employs a connection apparatus for the circuitboard, which is electrically connected between the main unit and each ofthe ink cartridges of the recording apparatus to thereby enable thetransfer of the information therebetween.

[0004]FIGS. 10A and 10B (10C) illustrate an example of a circuit board,which is used in the aforementioned recording apparatus. FIG. 10A is aplan view illustrating a state of the circuit board mounted on the inkcartridge, which is taken from above the top surface thereof. FIG. 10B(10C) is an enlarged sectional view illustrating a state of the circuitboard shown in FIG. 10A, which is taken in the direction of arrows fromline C-C.

[0005] A base (a substrate) 61 of the circuit board 27 is constitutedby, for example, a glass epoxy resin board, on the surface of which aplurality of contact pads 62 slide-contacted with and electricallyconducted to connector terminals (to be described) are formed. Further,solder resist film 63 is applied over the entire surface thereof withthe exception of places, at which the contact pads 62 are formed. FIG.10B shows a case where a minute clearance is formed between an edge ofthe solder resist film 63 and an edge of the contact pad 62, whereasFIG. 10C shows a case where the edge of the solder resist film 63 isoverlaid on the edge of the contact pad 62.

[0006] As a result of applying this resist film 63 thereon, circuitpatterns (not shown) conducted to the contact pads 62 and formed on thecircuit board are coated with the resist film 63. Thus, when the circuitboard 27 come in relative slide contact with a plurality of connecterterminals (to be described later), an occurrence of the electricalconduction between the circuit pattern and each of the connectorterminals can be prevented. Thus, this recording apparatus prevents anoccurrence of a problem that the information or data is destructed byapplying an unnecessary drive voltage from the connector terminals tothe circuit patterns formed on the circuit board 27 or byshort-circuiting the circuit patterns through the connector terminals.

[0007]FIG. 11 illustrates a state in which the connector terminals areslide-contacted with the circuit board 27. A semiconductor storageelement (a memory device) 65, for instance, EEPROM is mounted on therear surface of the circuit board 27, and electrically connected to thecontact pads 62 through the aforementioned circuit patterns and throughholes (not shown). Further, the semiconductor storage element 65 isfixed to the rear surface of the circuit board 27 by a mold resin 66.The circuit board 27 is attached to an end portion of a casing formedfrom a synthetic resin, which constitutes an outer part of the inkcartridge, in such a way as to place the contact pads 62 on the surfacethereof. This circuit board 27 is mounted in a concave portion 67 formedin the end portion of the casing to thereby perform the positioning ofthe circuit board 27.

[0008] Furthermore, when the ink cartridge is loaded into the cartridgeholder, the circuit board 27 is adapted so that a connector terminal 70formed from an elastic metal material placed in the cartridge holdercomes in relative slide contact with the circuit board 27 from thedirection of the surface of the circuit board 27 in such a way as tocause the connector terminal 70 having a curved end portion to come incontact with the pad 62 provided on the circuit board 27. That is, thecircuit board 27 advances in the direction of an arrow D shown in FIG.11. Thus, the connector terminals 70 are respectively brought intocontact with the pads 62 formed on the circuit board 27 and electricallyconducted thereto.

[0009] Further, a projecting part 68 projecting in the direction of thetop surface of the circuit board 27 is formed at a position, at whichthe circuit board 27 is mounted, on the end portion of the casing. Thisis performed so as to prevent the end portion of the circuit board 27from coming in contact with the connector terminals 70. That is, thebase 61 of the circuit board 27 is formed like a plate from a glassepoxy resin. This material has a problem that when the connectorterminals 70 directly touches the end portion, the glass material chipsand thus, the circuit board 27 is damaged. Consequently, the apparatusis deliberately configured so that the end portion of the circuit board27 does not touch the connector terminals 70.

[0010] When the connector terminal 70 is slid on the circuit board 27and then electrically connected to the pad 62 of the circuit board 27,dust or the like, which exists on the sliding contact path, may beadhered to the connector terminal 70 and intervene between the connectorterminal 70 and the pad 62.

[0011] In this case, the contact between the pad 62 and the connectorterminal 70 becomes insufficient. This disables operations of readingdata from and writing data to the semiconductor storage element 65mounted on the circuit board 27. Thus, in the case of utilizing theapparatus of this configuration in managing the ink cartridges in theink jet type recording apparatus, obstacles, such as disablement ofnormal printing operation of the recording apparatus, occur.

[0012] Further, in the case where the projecting portion is formed onthe circuit board mounting portion at the end of the circuit board, theconnector terminals 70 override the projecting part 68 and then come incontact with the surface of the circuit board 27. Since the circuitboard 27 advances in the direction of the arrow D. the end portions ofthe connector terminals 70 are brought into contact with the surfaces ofthe pads 62 formed on the circuit board 72. Therefore, when theconnector terminal 70 overrides the projecting part 68, the surface ofthe projecting part 68 formed from, for instance, a synthetic resin issubject to friction caused by the connector terminal 70, and thusundergoes an action by which the material is worn.

[0013] Also, in this case, the resin material becomes floury dust andadheres to the connector terminal 70. Then, such dust intervenes betweenthe pad 62 and the connector terminal 70.

SUMMARY OF THE INVENTION

[0014] This invention is accomplished by focusing attention to theaforementioned problems. Accordingly, an object of the invention is toprovide a connection apparatus for a circuit board, which is enabled toprevent an occurrence of long-term electrical poor contacting. Moreover,another object of the invention is to provide an ink jet type recordingapparatus enabled to ensure proper printing operation over a long timeperiod. Yet another object of the invention is to provide an IC chiphaving a structure that can eliminate the aforementioned problems. Stillanother object of the invention is to provide an ink cartridge having anIC chip that can eliminate the aforementioned problems.

[0015] To achieve the foregoing objects, according to an aspect of thisinvention, there is provided a connection apparatus for a circuit board,which is configured so that a contact pad electrically conducted tocircuit patterns arranged on a circuit board is formed on a circuitboard surface of the circuit board, and that a connector terminal formedfrom an elastic metal material is in contact with the contact pad bybeing in relative slide contact with said contact pad from a directionof a circuit board surface of said circuit board. In this connectionapparatus, a projecting part for preventing an end portion of thecircuit board from coming in contact with the connector terminal isdisposed adjacently to the end portion of the circuit board. A stepportion is formed on a slide contact path of the connector terminalbetween the end portion of the circuit board and the contact pad so thatthe step portion elastically deforms the connector terminal to riserelative to the circuit board surface.

[0016] In this case, preferably, the step portion is formed from metaltoil. Further, a preferred embodiment of the invention is configured sothat the step portion is formed between a base of the circuit board anda surface of the contact pad. Additionally, preferably, the circuitboard is coated with solder resist film with the exception of a placewhere the contact pad is formed, and a portion that is on the slidecontact-path of the connector terminal and that is adjacent to thecontact pad With such a configuration, the end portion of the connectorterminal overrides the projecting part and then comes in relative slidecontact with the top surface of the resist film formed on the circuitboard surface. Subsequently, the end portion falls onto a no-resist-filmformation part placed nearest to the contact pad. Finally, the endportion runs upon the top surface of the contact pad, so that theconnector terminal is brought into contact with the contact pad. Whenthe connector terminal finally runs upon the top surface of the contactpad, the dust adhering to the connector terminal is wiped and removed bythe step portion formed owing to the thickness of the contact pad at thefront end part of the contact pad by the action of such asliding-contact operation.

[0017] Therefore, the frequency of causing dust to intervene between thecontact pad and the connector terminal can be reduced. The reliabilityof the electrical contact between the connector terminal and the contactpad can be ensured. Further, the effect of wiping the dust adhering tothe connector terminal can be enhanced because the step portion isconstituted by metal foil that constitutes the contact pad.

[0018] Meanwhile, another preferred embodiment of this invention isconfigured so that the step portion is formed between the base of thecircuit board and the surface of the dummy pattern. In this case, it isdesirable that the dummy pattern is insulated from the circuit patternsarranged on the circuit board. Additionally, the dummy patterns separatefrom one another and correspondingly to the plural connector terminalsare preferably employed on the path of the connector terminals coming inslide contact with the contact pads. Furthermore, in each of theaforementioned configurations, preferably, the circuit board is coatedwith solder resist film so as not to cover the contact pads and portionsadjacent to the contact pads on the slide contact path of the connectorterminals.

[0019] In the case of employing such a configuration, the end portion ofthe connector terminal overrides the projecting part and then comes inslide contact with the circuit board surface. Subsequently, the endportion runs upon the top surface of the dummy pattern formed frommetallic foil. Then, the end portion comes in slide contact with the topsurface of the resist film. Finally, the end portion comes in contactwith the top surface of the contact pad. When the connector terminalruns upon the top surface of the dummy pattern, the dust adhering to theconnector terminal is wiped by the step portion formed owing to thethickness of the dummy pattern at the front end part of the dummypattern by the action of such a sliding-contact operation. Therefore,the frequency of causing dust to intervene between the contact pad andthe connector terminal can be reduced. The reliability of the electricalcontact between the-connector terminal and the contact pad can beensured.

[0020] Furthermore, to achieve the foregoing objects, according toanother aspect of the invention, there is provided an ink jet typerecording apparatus configured so that a signal is transferred between amain unit of a recording apparatus and a circuit board mounted on an inkcartridge in a state in which the circuit board is mounted on the inkcartridge, and in which the connector terminal is disposed in acartridge holder detachably supporting the ink cartridge.

[0021] In this case, preferably, the ink jet type recording apparatus isconfigured so that a readable/writable semiconductor storage element ismounted on the circuit board, and that information on the ink cartridgeloaded in the cartridge holder is read from and written to thesemiconductor storage element.

[0022] According to the ink jet type recording apparatus of theaforementioned configuration, the operations and effects of theaforementioned connection apparatus for a circuit board can be obtained.Moreover, information on the cartridge can be accurately transferredbetween the cartridge and the main unit of the recording apparatus.Therefore, proper printing operation of the recording apparatus can beassured The reliability of an operation of such a kind of an ink jettype recording apparatus can be ensured.

[0023] The present invention further provides the followingarrangements:

[0024] (1) An IC chip comprising:

[0025] a substrate;

[0026] a contact pad on a first surface of the substrate;

[0027] a resist film portion on the first surface of the substrate;

[0028] a memory device on a second, opposite surface of the substrate,the memory device being electrically connected to the contact pad;

[0029] a non-resist film portion exposing the first surface of thesubstrate, and being located in a first side of the contact pad in asurface direction of the substrate, wherein

[0030] the non-resist film portion and the contact pad define a steptherebetween;

[0031] the contact pad and the resist film portion form a clearancetherebetween in a second, opposite side of the contact pad in thesurface direction of the substrate;

[0032] a length of the non-resist portion in the surface direction ofthe substrate is larger than a length of the clearance in the surfacedirection of the substrate.

[0033] (2) The IC chip according to (1), wherein:

[0034] a plurality of said contact pads are disposed to form a staggeredarrangement; and

[0035] a plurality of said non-resist film portions are formedcorrespondingly to said contact pads to form a staggered arrangement.

[0036] (3) The IC chip according to (2), wherein said contact pads arearrayed into two rows, and a width of one row is longer than a width ofthe other row.

[0037] (4) The IC chip according to (3), wherein said non-resist filmportions are arrayed into two rows, and the non-resist film portions ofone row and the contact pads of the one row are alternately arranged ona straight line parallel to a direction of the rows.

[0038] (5) The IC chip according to (1), wherein a height of the stepportion is equal to a thickness of the contact pad.

[0039] (6) The IC chip according to (1), wherein a surface of thecontact pad is substantially flush with a surface of the resist filmportion.

[0040] (7) The IC chip according to (1), further comprising:

[0041] a second resist film portion on the first surface of thesubstrate, and being located in the first side of the contact pad in thesurface direction of the substrate, wherein the non-resist portion isinterposed between the second resist film portion and the contact pad inthe surface direction of the substrate.

[0042] (8) An IC chip comprising:

[0043] a substrate;

[0044] a contact pad on a first surface of the substrate;

[0045] a resist film portion on the first surface of the substrate;

[0046] a memory device on a second, opposite surface of the substrate,the memory device being electrically connected to the contact pad;

[0047] a dummy pattern on the first surface of the substrate;

[0048] a non-resist firm portion exposing the first surface of thesubstrate, and being located opposite from the contact pad with respectto the dummy pattern in a surface direction of the substrate, wherein

[0049] the non-resist film portion and the dummy pattern define a steptherebetween;

[0050] the contact pad and the resist film portion forma clearancetherebetween in the surface direction of the substrate;

[0051] a length of the non-resist portion in the surface direction ofthe substrate is larger than a length of the clearance in the surfacedirection of the substrate.

[0052] (9) The IC chip according to (8), wherein:

[0053] a plurality of said contact pads are disposed to form a staggeredarrangement; and

[0054] a single of said dummy pattern is formed correspondingly to allof said contact pads.

[0055] (10) The IC chip according to (8), wherein:

[0056] a plurality of said contact pads are disposed to form a staggeredarrangement; and

[0057] a plurality of said dummy patterns separated one from another areformed correspondingly to said contact pads to form a staggeredarrangement.

[0058] (11) The IC chip according to (9), wherein said contact pads arearrayed into two rows, and a width of one row is longer than a width ofthe other row.

[0059] (12) The IC chip according to (10), wherein said contact pads arearrayed into two rows, and a width of one row is longer than a width ofthe other row.

[0060] (13) The IC chip according to (8), wherein a height of the stepportion is equal to a thickness of the dummy pattern.

[0061] (14) The IC chip according to (8), wherein a surface of thecontact pad is substantially flush with a surface of the resist film anda surface of the dummy pattern.

[0062] (15) The IC chip according to (8), further comprising:

[0063] a second resist film portion on the first surface of thesubstrate, wherein the second resist film portion is interposed betweenthe dummy pattern and the contact pad in the surface direction of thesubstrate.

[0064] (16) An ink cartridge comprising:

[0065] a housing having a recessed portion;

[0066] the IC chip recited in any one of (1) to (15) and attached to therecessed portion.

[0067] (17) The ink cartridge according to (16), further comprising:

[0068] a projecting portion on the housing and adjacent to the recessedportion, wherein:

[0069] the projecting portion is located opposite from the contact padwith respect to the non-resist film portion in the surface direction ofthe substrate, and

[0070] the projecting portion extends beyond the contact pad in adirection perpendicular to the surface direction of the substrate.

[0071] (18) An ink jet recording apparatus comprising:

[0072] a carriage having a connector terminal;

[0073] an ink cartridge mountable onto the carriage, the ink cartridgeincluding:

[0074] a housing having a recessed portion;

[0075] the IC chip recited in any one of (1) to (15) and attached to therecessed portion, wherein:

[0076] when the ink cartridge is mounted onto the carriage, theconnector terminal is electrically connected to the contact pad afterthe connector terminal is slidingly contacted with the first surface ofthe substrate through the non-resist film portion and wiped by the stepportion.

[0077] (19) An ink jet recording apparatus comprising:

[0078] a carriage having a connector terminal;

[0079] an ink cartridge mountable onto the carriage, the ink cartridgeincluding:

[0080] a housing;

[0081] an IC chip attached to the housing, the IC chip having:

[0082] a substrate;

[0083] a contact pad on a first surface of the substrate;

[0084] a recessed portion on the first surface of the substrate, whereinthe recessed portion has a bottom recessed relative to a surface of thecontact pad and defines a step portion at an edge of the bottom;

[0085] when the ink cartridge is mounted onto the carriage, theconnector terminal is electrically connected to the surface of thecontact pad after the connector terminal is slidingly contacted with thebottom of the recessed portion and wiped by the step portion.

[0086] (20) The ink jet recording apparatus according to (19), whereinthe recessed portion is adjacent to the contact pad, and the stepportion is defined between the contact pad and the recessed portion.

[0087] (21) The ink jet recording apparatus according to (19), furthercomprising:

[0088] a dummy pattern on the first surface of the substrate andadjacent to the recessed portion, wherein the step is defined betweenthe dummy pattern and the recessed portion.

[0089] (22) The ink jet recording apparatus according to (19), furthercomprising:

[0090] a memory device located on a second, opposite surface of thesubstrate and electrically connected to the contact pad.

[0091] (23) The ink jet recording apparatus according to (19), whereinthe recessed portion is formed by exposing a part of the first surfaceof the substrate without applying a resist film onto that part.

[0092] (24) A circuit board comprising:

[0093] a substrate;

[0094] a contact pad formed on a first surface of the substrate, and tobe connected to a connector terminal by coming in sliding contact withthe connector terminal; and

[0095] a step portion formed by the first surface and the contact pad,and located at an upstream-side of the contact pad in a direction inwhich the connector terminal is connected to the contact pad.

[0096] (25) A circuit board comprising:

[0097] a substrate;

[0098] a contact pad formed on a first surface of the substrate, and tobe connected to a connector terminal by coming in sliding contact withthe connector terminal;

[0099] a dummy pattern formed on the first surface, and at leastpartially aligned with the contact pad along a direction in which theconnector terminal is connected to the contact pad; and

[0100] a step portion formed by the first surface and the dummy pattern,and located at an upstream side of the contact pad in the direction inwhich the connector terminal is connected to the contact pad.

[0101] (26) The circuit board according to (24) or (25), furthercomprising:

[0102] a resist film portion on the first surface; and

[0103] a non-resist film portion having the step portion.

[0104] (27) The circuit board according to (24), wherein

[0105] a plurality of the contact pads are disposed to form a staggeredarrangement;

[0106] a plurality of non-resist film portions are disposedcorrespondingly to the contact pads to form a staggered arrangement;

[0107] each of the non-resist film portions has a corresponding one ofthe step portions.

[0108] (28) The circuit board according to (24) or (25), furthercomprising:

[0109] a memory device on a second surface of the substrate oppositefrom the first surface.

[0110] (29) The circuit board according to (25), wherein

[0111] a plurality of the dummy patterns are disposed.

[0112] (30) The circuit board according to (29), wherein:

[0113] a plurality of the contact pads are disposed to form a staggeredarrangement;

[0114] the plurality of the dummy patterns are disposed correspondinglyto the contact pads to form a staggered arrangement.

[0115] (31) The circuit board according to (24), wherein

[0116] a height of the step portion is substantially equal to athickness of the contact pad.

[0117] (32) The circuit board according to (25), wherein

[0118] a height of the step portion is substantially equal to athickness of the dummy pattern.

[0119] (33) An ink cartridge comprising:

[0120] an ink storing portion storing at least ink;

[0121] an ink supply port communicating with the ink storing portion;and

[0122] the circuit board recited in any one of (24), (25), (27), (29),(30), (31) and (32).

[0123] (34) The ink cartridge according to (33), further comprising:

[0124] a mounting portion at which the circuit board is mounted to theink cartridge;

[0125] a projecting portion located at an upstream side of the mountingportion in the direction in which the connector terminal is connected tothe contact pad,

[0126] wherein the projecting portion extends beyond the contact pad.

[0127] The present disclosure relates to the subject matter contained inJapanese patent application No. 2001-229938 (filed on Jul. 30, 2002),which is expressly incorporated herein by reference in its entirety.

BRIEF DESCRIPTION OF THE DRAWINGS

[0128]FIG. 1 is a plan view illustrating the entire configuration of anink jet type recording apparatus to which this invention is applied.

[0129]FIG. 2 is a schematic view illustrating an ink supply systemincluding from ink cartridges to a recording head.

[0130]FIG. 3 is a perspective view illustrating the configuration of afront-side part of a cartridge holder.

[0131]FIG. 4 is a view illustrating the configuration of each of opposedparts of a connection mechanism, which is disposed in the cartridgeholder, and the ink cartridge.

[0132]FIG. 5 is a perspective view illustrating a terminal mechanismpart of the connection mechanism shown in FIG. 4 by enlarging theterminal mechanism part.

[0133]FIGS. 6A and 6B (6C) are configuration views each illustrating afirst preferred embodiment of a circuit board.

[0134]FIGS. 7A, 7B, 7C, and 7D are operation explanatory views eachillustrating an operation in the case of using the circuit board shownin FIGS. 6A and 6B (6C).

[0135]FIGS. 8A and 8B (8C) are configuration views each illustrating asecond preferred embodiment of the circuit board.

[0136]FIGS. 9A and 9B are configuration views each illustrating a thirdpreferred embodiment of the circuit board.

[0137] FIGA. 10A and 10B (10C) are configuration views each illustratinga conventional circuit board.

[0138]FIG. 11 is an operation explanatory view-illustrating an operationin the case of using the circuit board shown in FIG. 10.

DESCRIPTION OF THE PREFERRED EMBODIMENT

[0139] Hereinafter, an embodiment of this invention, which is aconnection apparatus for a circuit board according to this inventionapplied to an ink jet type recording apparatus, is described. Referringfirst to FIG. 1, there is shown a top view of the entire configurationof the inkjet type recording apparatus that can preferably utilize thisinvention. In FIG. 1, reference character 1 designates a carriage. Thiscarriage 1 is configured so as to reciprocatively be moved in alongitudinal direction of a paper feed member 5 guided by a scanningguide member 4, that is, a main scanning direction, which is a directionof width of recording paper, through a timing belt 3 driven by acarriage motor 2. Further, although not shown in FIG. 1, an ink jet typerecording head 6 (to be described later) is mounted on the carriage 1.

[0140] Furthermore, subtanks 7 a to 7 d for supplying ink to therecording head are mounted on the carriage 1. In this embodiment, thesesubtanks 7 a to 7 d are four tanks, each of which is provided in such away as to temporarily store a corresponding kind of ink and as tocorrespond to a corresponding one of colors of ink (for instance, blackink, and yellow ink, cyan ink, and magenta color ink).

[0141] Further, this embodiment is configured so that black ink and suchkinds of color ink are supplied to these subtanks 7 a to 7 d throughflexible ink supply tubes 10, . . . , 10 respectively constitutingsupply lines from ink cartridges (hereunder referred to as main tanks) 9a to 9 d loaded in the cartridge holder, which is placed in the mainunit of the recording apparatus.

[0142] On the other hand, a capping means 11 enabled to cover a nozzleorifice of a recording head is disposed at a nonprint area (or a homeposition) on a movement path of the carriage 1. Furthermore, a cappingmember 11 a formed from an elastic material, such as rubber, and enabledto seal the nozzle formation surface of the recording head the topsurface of this capping means 11 by being brought into intimate contacttherewith. Further, when the carriage 1 moves to the home position, thecapping means 11 moves (or rises) to the recording head, so that thenozzle formation surface of the recording head can be sealed with thecapping member 11 a.

[0143] This cap member 11 a functions as a cap element for sealing thenozzle formation surface of the recording bead during an idle period ofthe recording apparatus, and for preventing a nozzle opening fromdrying. Further, an end of a tube of a suction pump (that is, a tubepump) is connected to this cap member 11 a The cap member 11 a isadapted to perform a cleaning operation of causing a negative pressure,which is generated by the suction pump, to act upon the recording head,and sucking and discharging ink from the recording head.

[0144] Meanwhile, a wiping member 12 formed like a strip and made of anelastic material, such as rubber, is placed adjacently to a print areaof the capping means 11, and configured so as to advance in a horizontaldirection to the movement path of the recording head, as occasiondemands, and wipe and clean the nozzle formation surface.

[0145] Referring next to FIG. 2, there is shown a schematic view of theconfiguration of the ink supply system mounted on the recordingapparatus illustrated in FIG. 1. This ink supply system is describedhereinbelow by referring to FIG. 2 and FIG. 1, in which the ink supplysystem is designated by the same reference character. In FIGS. 1 and 2,reference character 21 denotes an air compression pump 21. This systemis configured so that air pressurized by this air compression pump 21 issupplied to a pressure regulating valve 22, and that then, such air issupplied to each of the main tanks 9 a to 9 d (in FIG. 2, the main tanksare collectively and simply denoted by reference character 9, andhereunder, the main tanks are sometimes designated simply andgenerically by reference character 9) through a pressure sensor 23.

[0146] In this case, the system is configured so that air flow channelsbranch from the pressure sensor 23 to the main tanks 9, and thatpressurized air is applied to the main tanks loaded in the cartridgeholder 8. The pressure regulating valve 22 has a function ofdecompressing air and maintaining the air pressure, which is applied toeach of the main tanks 9 a to 9 d, within a predetermined range when theair pressurized by the air compression pump 21 reaches anoverpressurized state owing to some trouble.

[0147] Further, the pressure sensor 23 functions in such a way as todetect the air pressure pressurized by the air compression pump 21 andas to control an operation of driving the air compression pump 21. Thatis, when the sensor 23 detects that the air pressure pressurized by theair compression pump 21 reaches a predetermined pressure, the sensor 23stops the operation of driving the air compression pump 21 according tothis detected fact. Conversely, when the sensor 23 detects that-the airpressure pressurized by the air compression pump 23 becomes equal to orless than a predetermined pressure, the system controls the sensor 23 insuch a manner as to drive the air compression pump 21. By repeating suchoperations, the pressure sensor 23 functions in such a way as tomaintain the air pressure applied to each of the main tanks 9 a to 9 dwithin the predetermined range.

[0148] As is seen from FIG. 2 schematically showing the configuration ofthe main tank 9, a case constituting an outer part thereof is formed insuch a way as to be in an airtight state. An ink pack 24 made of aflexible material, in which ink is contained, is accommodated in themain tank 9. Further, the main tank 9 is configured so that a spacedefined by the main tank 9 and the ink pack 24 constitutes a pressurechamber 25, and that pressurized air is supplied into this pressurechamber 25 through the pressure sensor 23.

[0149] With this configuration, the ink pack 24 accommodated in each ofthe main tanks 9 a to 9 d is pressurized by the pressurized air, so thatan ink flow from each of the main tanks 9 a to 9 d to a correspondingone of the subtanks 7 a to 7 d is generated by a predetermined pressure.

[0150] Incidentally, as shown in FIG. 2, a circuit board 27, on which asemiconductor storage element (a memory device) implemented by, forexample, EEPROM is mounted, is attached to a part of the case of themain tank 9 serving as an ink cartridge. For example, information on thekind (for instance, information for discriminating dye ink or pigmentedink), color, and remaining amount of ink contained in the ink cartridgeis stored in the semiconductor storage element mounted on this circuitboard 27. Further, as illustrated in FIG. 2, a terminal 28 (thiscorresponds to the contact pad 62), at which the information can be readfrom and written to the semiconductor storage element, is disposed at apart of the main tank 9, and configured so as to be able to beelectrically connected to the recording apparatus in the case that themain tank 9 is attached to the recording apparatus.

[0151] Meanwhile, the system is configured so that ink pressurized ineach of the main tanks 9 a to 9 d is supplied to a corresponding one ofthe subtanks 7 a to 7 d mounted on the carriage 1 (in FIG. 2, thesubtanks are collectively designated by reference character 7, andhereunder, the tanks are sometimes denoted simply and generically byreference character 7) through a corresponding one of the ink supplyvalve 26, . . . , 26 and a corresponding one of the ink supply tubes 10,. . . , 10.

[0152] The basic configuration of this subtank 7 is established so thata float member 31 is disposed therein, and that a permanent magnet 32 isattached to a part of the float member 31. Further, magnetoelectricalconversion elements 33 a and 33 b typified by Hall elements are mountedon the circuit board 34, and attached and connected to a side wall ofthe subtank 7.

[0153] With this configuration, an ink amount detecting means isconstituted by including the float member 31, the permanent magnet 32disposed on the float member 31, and output generating means foroutputting an electrical output generated by the Hall elements 33 a and33 b according to a magnetic dose that is generated by the permanentmagnet 32 according to a position to which the float member rises.

[0154] In this embodiment, the ink amount detecting means is utilized insuch a way as to detect that an amount of ink contained in each of thesubtanks 7 reaches a predetermined amount (corresponding to an ink fullstate) by supplying ink from each of the main tanks 9 to a correspondingone of the subtanks 7. In this case, the system is configured so thatthe ink supply valve 26 is closed according to the electrical output ofthe Hall elements 33 a and 33 b.

[0155] Further, in the case where it is detected from the electricaloutputs of the Hall elements that opened according to the electricaloutputs of the Hall elements 33 a and 33 b that the amount of inkcontained in the subtank reaches an amount (corresponding to a lowink-amount state), which is equal to or less than a predeterminedvolume, by performing a print operation, the system operates in such away as to open the ink supply valve 26. Thus, the ink pressurized ineach of the individual main tanks 9 is supplied to a corresponding oneof the subtanks 7, in which the consumption of ink progresses.Therefore, the system operates so that ink is intermittently suppliedfrom the main tanks to the subtanks by repeating the operations asdescribed above, and that ink of an amount, which is within apredetermined range, is always stored in each of the subtanks.

[0156] Furthermore, as illustrated in FIG. 2, the system is configuredso that ink is supplied from each of the subtanks 7 to the recordinghead 6 through the valve 35 and the tube 36 connected thereto. Thesystem operates so that ink droplets are outputted from a nozzle opening6 a formed in the nozzle formation surface of the recording head 6according to print data supplied to an actuator (not shown) of therecording head 6. Incidentally, in FIG. 2, reference character 11designates the capping means. The tube connected to this capping means11 is also connected to a suction pump (not shown).

[0157] Referring next to FIG. 3, there is shown a view of theconfiguration of a front-side part of the cartridge holder 8. A covermember 41, which is opened when the main tank is attached thereto ordetached therefrom, is equipped in this cartridge holder 8. That is, thesystem is configured so that this cover member 41 is placed at anopening front face of the cartridge holder 8, that a turning shaft 41 ais supported by a support hole (not shown) formed in the main unit ofthe recording apparatus, and that the opening front face of thecartridge holder 8 can be opened (corresponding to a state indicated bysolid lines) or closed (corresponding to a state indicated by chainlines) by turning the cover member 41 around the turning shaft 41 a.

[0158] A plurality of operating levers 42 are disposed inside the closedcover member 41 correspondingly to the main tanks 9 loaded in thecartridge holder 8. A locking hole 42 a is formed in each of a base partof each of these operating levers 42. Each of the operating levers 42 isturnably supported by a supporting rod inserted into the locking hole 42a formed therein.

[0159] Further, each of the main tanks 9 can be loaded or unloaded byturning the operating levers 42 in the same direction as the direction,in which the cover member 41 is opened, during a state in which thecover member 41 is opened. That is, when the main tank 9 is loaded intothe cartridge holder 8, the main tank 9 is inserted thereinto during theoperating levers 42 are turned in the same direction as that in whichthe cover member 41 is opened. Then, the operating levers 42 are setup.Thus, a pressing portion 42 b formed in each of the operating levers 42abuts against a front side end portion of a corresponding one of themain tanks 9, so that the main tanks 9 are loaded in the holder 8according to the principle of leverage.

[0160] Furthermore, when the main tank 9 loaded in the holder 8 is drawnout therefrom, the operating levers 42 are turned in the same directionas that in which the cover member 41 is opened. Thus, although not shownin the figure, the main tank 9 is pushed out from the back side of theholder 8 through a link rod engaged with a part of the operating levers42. Consequently, the main tank 9 pushed out in the direction of a nearside, as viewed in the figure, can be easily pulled out.

[0161] An electrical switch 43 for detecting the opening of the covermember 41 is further provided in the cartridge holder 8. For example, atact switch is used as this switch 43 which is put into an on-state bybeing in contact with the rear surface of the cover member 41 during thestate in which the cover member 41 is closed, and which is put into anoff-state during the state in which the cover member 41 is opened. Thisswitch 43 is adapted to forcedly open the pressure regulating valve 22during the off-state. Thus, during each of the ink cartridges isexchanged, when the cover member 41 is opened, the switch 43 operates insuch a way as to cause the pressurized air, which is provided to each ofthe ink cartridges, to flow into the air.

[0162]FIG. 4 is a sectional view of the configuration of a connectionmechanism placed in the cartridge holder 8 and the configuration of anend-portion of the main tank 9 serving as an ink cartridge. Pairedopening holes 51 each serving as a positioning means utilized whenloading the ink cartridge into the recording apparatus are formed ineach of the main tanks 9 serving as ink cartridges. Further, an inkoutlet part 50 for leading ink out of the ink pack 24 is mounted in analmost middle portion intervening between the paired positioningopening-holes 51. Further, an inlet port 52 for pressurized air, and acircuit board 27, on which a semiconductor storage element enabled toreading/writing of information on the ink cartridge is mounted, aredisposed on both outer sides of each of the opening holes 51 formed inthe two places.

[0163] Meanwhile, paired positioning pins 56 each formed like a cylinderare placed in a connection mechanism 55 placed in the cartridge holder8. The system is configured so that the paired positioning opening-holes51 formed in the main tank 9 are provided in such a way as to surroundeach of the positioning pins 56.

[0164] Thus, the positioning opening-holes 51 are placed at two placesin the case of the main tank 9. Consequently, the three-dimensionalpositioning of the main tanks 9 serving as the cartridges can beachieved by attaching the two positioning pins 56, which are placed onthe recording apparatus, to the base part. A hollow ink inlet tube 57disposed at a nearly central part intervening the paired positioningpins 56 is inserted into the ink outlet part 50 for leading ink out ofthe ink pack 24, so that the system is put into a condition in which inkcan be led out from the cartridges.

[0165] Further, an inlet port 52 for pressurized air is connected to anoutlet port 58 for pressurized air, which is placed in the cartridgeholder 8, by loading the main tank 9 thereinto. Thus, the system is putinto a condition in which pressurized air is introduced into the maintank 9. Moreover, a terminal mechanism 59 having a plurality ofconnector terminals is connected to the circuit board 27 placed on themain tank 9. Thus, the system is brought into a condition in which thetransfer of data between the semiconductor storage element provided onthe circuit board 27 and the terminal can be realized.

[0166]FIG. 5 illustrates the configuration of the terminal mechanism 59,which is taken from the back surface thereof in contrast with FIG. 4taken from the opposite surface thereof. That is, FIG. 5 shows theconfiguration in which the connector terminals 70 to be electricallycontacted with the surface of the circuit board 27 placed on the maintank 9 are arranged. Each of these connector terminals 70 is formed froman elastic metal material, for example, phosphor bronze, and has seventerminals that respectively correspond to the contact pads formed on thecircuit board 27 of the main tank 9 and that are arranged in what iscalled a staggering manner.

[0167] Further, each of the end portions of the connector terminals 70is formed like an arc. The end portions of the connector terminals 70are configured so that when the connector terminals 70 are brought intorelative contact with a surface of the circuit board from a direction ofthe surface thereof, the arcuate outer peripheral surface is put intoslide contact with the circuit board surface. Thus, when the main tankis detached and attached, the frictional resistance of each of theconnector terminals 70, which is put into slide contact with the circuitboard surface, can be reduced. Further, each of the connector terminals70 are connected to a read/write circuit (not shown) mounted on therecording apparatus. Data is transferred between this circuit and thesemiconductor storage element mounted on the circuit board 27.

[0168] Meanwhile, FIGS. A and 6B (6C) illustrate a first preferredembodiment of the circuit board (IC chip) 27 placed on the ink cartridgeserving as the main tank 9. Further, FIG. 6A is a plan view of thecircuit board, which is taken from above the top surface. FIG. 6B (6C)is an enlarged sectional view of the circuit board, which is taken fromline A-A in the direction of arrows shown in FIG. 6A. Incidentally, thebasic configuration of this circuit board 27 is similar to the circuitboard previously described with reference to FIGS. 10A and 10B (10C).Therefore, the corresponding portions are designated by the samereference characters.

[0169] The circuit board 27 shown in FIGS. 6A and 6B (6C) is coated withsolder resist film 63 with the exception of places, at which the contactpads 62 are formed, and portions that are on the path of the-connectorterminals 70 coming in slide contact with the contact pads 62 and thatare adjacent to the contact pads 62. Incidentally, the thickness of eachof the contact pads 62 is about 40 μm or so. Similarly, the thickness ofthe resist film 63 is about 40 μm or so. Hence, as illustrated in FIG.6B (6C), a no-resist-film formation part 61 a, on which resist film 63is not formed, that is, an exposed part of the circuit board base(substrate) 61 is formed as a concave part that is about 40 μm in depth.Consequently, a step portion 62 a is formed between the circuit boardsurface 61 a serving as a part, on which the resist film 63 is notformed, and the surface of each of the contact pads 62 formed frommetallic foil (for example, copper foil).

[0170]FIGS. 7A, 7B, 7C and 7D illustrate the manners, in which theconnector terminals 70 are brought into relative slide contact with thecircuit board 27 of the aforementioned configuration, in sequence.Incidentally, similarly as the semiconductor storage element of thecircuit board of the configuration illustrated in FIG. 11, asemiconductor storage element (memory device) 65, for example, EEPROM ismounted on the rear surface of the circuit board 27, and electricallyconnected to the contact pads 62 through circuit patterns (not shown)and through holes (not shown). Furthermore, the semiconductor element 65is fixed onto the rear surface of the circuit board 27 by a mold resin66. Furthermore, as described with reference to FIG. 11, the circuitboard 27 is attached to the ink cartridge so that the contact pads 62are located at a leading end portion of a case formed from a syntheticresin, which constitutes an outer part of the ink cartridge, in such away as to place on the surface thereof.

[0171] Incidentally, FIG. 7A illustrates an initial state in the casethat the ink cartridge 9 is loaded into the cartridge holder 8. Then,the process of loading the ink cartridge is performed through stepsillustrated in FIGS. 7B and 7C. FIG. 7D illustrates a state in which theloading of the ink cartridge 9 is completed. First, in the case that theink cartridge is loaded into the cartridge holder as illustrated in FIG.7A, the end portion of the connector terminal 70 disposed on thecartridge holder 8 is caused to override a projecting part 68 formed onthe ink cartridge. At that time, the projecting part 68 undergoes theslide contact with the connector terminal 70. A part of a syntheticresin material constituting the outer case of the cartridge is worn, andthe worn material becomes floury dust 71, which then adheres to theconnector terminal 70.

[0172] Subsequently, as illustrated in FIG. 7B, the connector terminal70 comes in slide contact with the top surface of the resist film 63formed on the circuit board surface with the dust 71 adheres thereto.Moreover, as illustrated in FIG. 7C, the connector terminal 70 falls tothe part 61 a, on which no resist film is formed, provided nearest tothe contact pad 62. Finally, as illustrated in FIG. 7D, the connectorterminal 70 undergoes elastic deformation and runs upon the top surfaceof the contact pad 62, so that the connector terminal 70 comes incontact with the contact pad 62. At that time, the dust adhering to theconnector terminal 70 is wiped by the step portion 62 a formed owing tothe thickness of the contact pad 62.

[0173] Therefore, the frequency of causing the dust to intervene betweenthe contact pad and the connector terminal can be reduced. Thereliability of the electrical contact between the connector terminal andthe contact pad can be ensured. Further, the effect of wiping the dustadhering to the connector terminal can be enhanced because the stepportion 62 a is constituted by metal foil that constitutes the contactpad 62.

[0174] Incidentally, in the configuration of the circuit board 27described with reference to FIGS. 6A to 7D, the resist film 63 isapplied on the surface of the circuit board. However, in the case thatno circuit patterns are present on the path on which the connectorterminals 70 come in slide contact with the circuit board 27, the resistfilm 63 can be omitted. That is, the resist film 63 serves to preventthe circuit pattern from undergoing electrical trouble by touching theconnector terminal 70. Therefore, in other words, in the case that acircuit pattern is present on the path, on which the connector terminals70 come in slide contact with the circuit board 27, resist film may beformed only on the part of the path-where the circuit pattern ispresent.

[0175]FIGS. 8A and 8B (8C) illustrate a second preferred embodiment ofthe circuit board 27. Further, FIG. 8A is a plan view taken from abovethe top surface of the circuit board. FIG. 8B (8C) is an enlargedsectional view taken from line B-B in a direction of arrows shown inFIG. 8A. Incidentally, the basic configuration of this circuit board 27is similar to the circuit board previously described with reference toFIGS. 6A and 6B (6C). Therefore, the corresponding portions are denotedby the same reference characters.

[0176] In the second example of this circuit board 27, a dummy pattern69 made of metallic foil is formed on the path, on which the connectorterminals 70 come in slide contact with the circuit board 27. This dummypattern 69 is formed on the circuit board base 61 simultaneously whenthe contact pads 62 and the circuit patterns (not shown) are formedthereon by an etching process. Therefore, the dummy pattern 69 can beformed so that the thickness thereof is nearly equal to the thickness ofthe contact pad 62.

[0177] Further, in the case of this embodiment, the circuit board iscoated with solder resist film with the exception of places, where thecontact pads are formed, and positions (that is, the left side area, asviewed in each of FIGS. 8A and 8B (8C)) that are on the slide contactpath of connector terminals 70 and that are more front than the dummypattern. This configuration utilizes the thickness of the dummy pattern69 to define a step portion 69 a that rises relative to the portion 61a, on which the resist film 63 is not formed, that is, the exposed partof the circuit board base 61.

[0178] Therefore, similarly as the step portion of the example describedwith reference to FIGS. 7A to 7D, the step portion 69 a performs anoperation of wiping the dust adhering to the connector terminals 70.Hence, the embodiment of the configuration illustrated in FIGS. 8A and8B (8C) can obtain operations and effects similar to those of theembodiment of the configuration illustrated in FIGS. 6A to 7D.Incidentally, preferably, the dummy pattern 69 is insulated from thecircuit patterns (not shown) arranged on the circuit board 27. With thisconfiguration, the semiconductor storage element 65 mounted on thecircuit board 27 can be prevented from undergoing electrical troubleswhen the connector terminal 70 touches the dummy pattern 69.

[0179] Referring further to FIG. 9, there is shown a plan view of athird preferred embodiment of the circuit board 27. Incidentally, evenin this FIG. 9, parts corresponding to the previously described portionsare designated by the same reference characters. In the embodimentillustrated in this FIG. 9, the dummy patterns 69 are formed on theslide contact path of the connector terminals in such a manner as toseparate from one another correspondingly to the plural connectorterminals. Even in the case of the circuit board of this configuration,similarly as in the embodiment illustrated in FIGS. 8A and 8B (8C), astep portion 69 a corresponding to the thickness of the dummy pattern 69is formed on the exposed part 61 a of the circuit board base 61. Thisstep portion performs an operation of wiping the dust adhering to theconnector terminal 70, similarly as the embodiments already described.Thus, even in the circuit board of the configuration illustrated in FIG.9 can obtain operations and effects similar to those of the embodimentsalready described.

[0180] Incidentally, according to the configuration illustrated in FIG.9, the dummy patterns 69 are formed on the slide contact path of theconnector terminals in such a way as to separate from one anothercorrespondingly to the plural connector terminals, Therefore, theconnector terminals 70 can be prevented from being short-circuited toone another through the dummy patterns 69 when each of the connectorterminals 70 passes on the dummy pattern 69 by being put into slidecontact therewith. Consequently, a read/write circuit (not shown)mounted on the recording apparatus can be prevented from undergoingelectrical troubles.

[0181] As described above, according to a circuit board of thisinvention, a step portion is formed on a path of a connector terminalcoming into slide contact with a circuit board having a contact pad.Thus, dust adhering to the connector terminal can be removed by the stepportion. Consequently, the reliability of the electrical contact betweenthe contact pad and the connector terminal can be ensured.

[0182] Further, in the case where a projecting part is formed to preventthe connector terminal from coming in contact with the end portion ofthe circuit board, dust adhering to the connector terminal due to wearof the projecting part can be removed by the step portion.

[0183] Further, proper operation of the recording apparatus can beensured by utilizing the connection apparatus of the invention in theink jet type recording apparatus configured so that a signal istransferred between the main unit thereof and the circuit board mountedon the ink cartridge in the state in which the circuit board is mountedon the ink cartridge. The reliability of operations of such a kind ofthe ink jet type recording apparatus can be assured.

[0184] In addition, in the arrangement (1) discussed above, the firstsurface of the substrate exposed by the non-resist film portion may havean additional layer (a thin film, a protective layer, etc.) appliedthereon as long as the non-resist film portion and the contact paddefine the step therebetween.

[0185] Similarly, in the arrangement (8) discussed above, the firstsurface of the substrate exposed by the non-resist film portion may havean additional layer (a thin film, a protective layer, etc.) appliedthereon as long as the non-resist film portion and the dummy patterndefine the step therebetween.

[0186] Similarly, in the arrangement (19) discussed above, the bottom ofthe recessed portion may be formed by the first surface of thesubstrate, and alternatively may be formed by a surface of an additionallayer (a thin film, a protective layer, etc.) applied on the firstsurface of the substrate.

[0187] In the arrangement (24) discussed above, the first surfaceforming the step portion may be formed by a surface of a substrate base,and alternatively may be formed by an additional layer (a thin film, aprotective layer, etc.) applied on the surface of the substrate base.

[0188] In the arrangement (25) discussed above, the first surfaceforming the step portion may be formed by a surface of a substrate base,and alternatively may be formed by an additional layer (a thin film, aprotective layer, etc.) applied on the surface of the substrate base.

What is claimed is:
 1. An IC chip comprising: a substrate; a contact padon a first surface of the substrate; a resist film portion on the firstsurface of the substrate; a memory device on a second, opposite surfaceof the substrate, the memory device being electrically connected to thecontact pad; a non-resist firm portion exposing the first surface of thesubstrate, and being located in a first side of the contact pad in asurface direction of the substrate, wherein the non-resist film portionand the contact pad define a step therebetween; the contact pad and theresist film portion forma clearance therebetween in a second, oppositeside of the contact pad in the surface direction of the substrate; alength of the non-resist portion in the surface direction of thesubstrate is larger than a length of the clearance in the surfacedirection of the substrate.
 2. The IC chip according to claim 1,wherein: a plurality of said contact pads are disposed to form astaggered arrangement; and a plurality of said non-resist film portionsare formed correspondingly to said contact pads to form a staggeredarrangement.
 3. The IC chip according to claim 2, wherein said contactpads are arrayed into two rows, and a width of one row is longer than awidth of the other row.
 4. The IC chip according to claim 3, whereinsaid non-resist film portions are arrayed into two rows, and thenon-resist film portions of one row and the contact pads of the one roware alternately arranged on a straight line parallel to a direction ofthe rows.
 5. The IC chip according to claim 1 wherein a height of thestep portion is equal to a thickness of the contact pad.
 6. The IC chipaccording to claim 1, wherein a surface of the contact pad issubstantially flush with a surface of the resist film portion.
 7. The ICchip according to claim 1, further comprising: a second resist filmportion on the first surface of the substrate, and being located in thefirst side of the contact pad in the surface direction of the substrate,wherein the non-resist portion is interposed between the second resistfilm portion and the contact pad in the surface direction of thesubstrate.
 8. An IC chip comprising: a substrate; a contact pad on afirst surface of the substrate; a resist film portion on the firstsurface of the substrate; a memory device on a second, opposite surfaceof the substrate, the memory device being electrically connected to thecontact pad; a dummy pattern on the first surface of the substrate; anon-resist firm portion exposing the first surface of the substrate, andbeing located opposite from the contact pad with respect to the dummypattern in a surface direction of the substrate, wherein the non-resistfilm portion and the dummy pattern define a step therebetween; thecontact pad and the resist film portion form a clearance therebetween inthe surface direction of the substrate; a length of the non-resistportion in the surface direction of the substrate is larger than alength of the clearance in the surface direction of the substrate. 9.The IC chip according to claim 8, wherein: a plurality of said contactpads are disposed to form a staggered arrangement; and a single of saiddummy pattern is formed correspondingly to all of said contact pads. 10.The IC chip according to claim 8, wherein: a plurality of said contactpads are disposed to form a staggered arrangement; and a plurality ofsaid dummy patterns separated one from another are formedcorrespondingly to said contact pads to form a staggered arrangement.11. The IC chip according to claim 9, wherein said contact pads arearrayed into two rows, and a width of one row is longer than a width ofthe other row.
 12. The IC chip according to claim 10, wherein saidcontact pads are arrayed into two rows, and a width of one row is longerthan a width of the other row.
 13. The IC chip according to claim 8,wherein a height of the step portion is equal to a thickness of thedummy pattern.
 14. The IC chip according to claim 8, wherein a surfaceof the contact pad is substantially flush with a surface of the resistfilm and a surface of the dummy pattern.
 15. The IC chip according toclaim 8, further comprising: a second resist film portion on the firstsurface of the substrate, wherein the second resist film portion isinterposed between the dummy pattern and the contact pad in the surfacedirection of the substrate.
 16. An ink cartridge comprising: a housinghaving a recessed portion; the IC chip recited in any one of claims 1 to15 and attached to the recessed portion.
 17. The ink cartridge accordingto claim 16, further comprising: a projecting portion on the housing andadjacent to the recessed portion, wherein: the projecting portion islocated opposite from the contact pad with respect to the non-resistfilm portion in the surface direction of the substrate, and theprojecting portion extends beyond the contact pad in a directionperpendicular to the surface direction of the substrate.
 18. An ink jetrecording apparatus comprising: a carriage having a connector terminal;an ink cartridge mountable onto the carriage, the ink cartridgeincluding: a housing having a recessed portion; the IC chip recited inany one of claims 1 to 15 and attached to the recessed portion, wherein:when the ink cartridge is mounted onto the carriage, the connectorterminal is electrically connected to the contact pad after theconnector terminal is slidingly contacted with the first surface of thesubstrate through the non-resist film portion and wiped by the stepportion.
 19. An ink jet recording apparatus comprising: a carriagehaving a connector terminal; an ink cartridge mountable onto thecarriage, the ink cartridge including: a housing; an IC chip attached tothe housing, the IC chip having: a substrate; a contact pad on a firstsurface of the substrate; a recessed portion on the first surface of thesubstrate, wherein the recessed portion has a bottom recessed relativeto a surface of the contact pad and defines a step portion at an edge ofthe bottom; when the ink cartridge is mounted onto the carriage, theconnector terminal is electrically connected to the surface of thecontact pad after the connector terminal is slidingly contacted with thebottom of the recessed portion and wiped by the step portion.
 20. Theink jet recording apparatus according to claim 19, wherein the recessedportion is adjacent to the contact pad, and the step portion is definedbetween the contact pad and the recessed portion.
 21. The ink jetrecording apparatus according to claim 19, further comprising: a dummypattern on the first surface of the substrate and adjacent to therecessed portion, wherein the step is defined between the dummy patternand the recessed portion.
 22. The ink jet recording apparatus accordingto claim 19, further comprising: a memory device located on a second,opposite surface of the substrate and electrically connected to thecontact pad.
 23. The ink jet recording apparatus according to claim 19,wherein the recessed portion is formed by exposing a part of the firstsurface of the substrate without applying a resist film onto that part.24. A circuit board comprising: a substrate; a contact pad formed on afirst surface of the substrate, and to be connected to a connectorterminal by coming in sliding contact with the connector terminal; and astep portion formed by the first surface and the contact pad, andlocated at an upstream side of the contact pad in a direction in whichthe connector terminal is connected to the contact pad.
 25. A circuitboard comprising: a substrate; a contact pad formed on a first surfaceof the substrate; and to be connected to a connector terminal by comingin sliding contact with the connector terminal; a dummy pattern formedon the first surface, and at least partially aligned with the contactpad along a direction in which the connector terminal is connected tothe contact pad; and a step portion formed by the first surface and thedummy pattern, and located at an upstream side of the contact pad in thedirection in which the connector terminal is connected to the contactpad.
 26. The circuit board according to claim 24 or 25, furthercomprising: a resist film portion on the first surface; and a non-resistfilm portion having the step portion.
 27. The circuit board according toclaim 24, wherein a plurality of the contact pads are disposed to form astaggered arrangement; a plurality of non-resist film portions aredisposed correspondingly to the contact pads to form a staggeredarrangement; each of the non-resist film portions has a correspondingone of the step portions.
 28. The circuit board according to claim 24 or25, further comprising: a memory device on a second surface of thesubstrate opposite from the first surface.
 29. The circuit boardaccording to claim 25, wherein a plurality of the dummy patterns aredisposed.
 30. The circuit board according to claim 29, wherein: aplurality of the contact pads are disposed to form a staggeredarrangement; the plurality of the dummy patterns are disposedcorrespondingly to the contact pads to form a staggered arrangement. 31.The circuit board according to claim 24, wherein a height of the stepportion is substantially equal to a thickness of the contact pad. 32.The circuit board according to claim 25, wherein a height of the stepportion is substantially equal to a thickness of the dummy pattern. 33.An ink cartridge comprising: an ink storing portion storing at leastink; an ink supply port communicating with the ink storing portion; andthe circuit board recited in any one of claims 24, 25, 27, 29, 30, 31and
 32. 34. The ink cartridge according to claim 33, further comprising:a mounting portion at which the circuit board is mounted to the inkcartridge; a projecting portion located at an upstream side of themounting portion in the direction in which the connector terminal isconnected to the contact pad, wherein the projecting portion extendsbeyond the contact pad.